陈志强
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个人信息Personal Information
讲师（高校） 硕士生导师
性别：男
毕业院校：西安电子科技大学
学历：博士研究生毕业
学位：博士研究生毕业
在职信息：在岗
所在单位：机电工程学院
入职时间：2020-07-01
学科：机械电子工程
办公地点：北校区主楼三区413-3
电子邮箱：
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- Zhiqiang Chen,Wei Quan,Zhongbin Xie.Experimental and Electromagnetic Analysis of the Minimal Influence of Top-Surface Roughness on S-Band Bandpass Filters.[J]:Physica Scripta,2026,101(2):025902
- Zhao Li,Wenchao Tian,Liangchen Bai,Zhiqiang Chen,Yongkun Wang.Investigations on the interfacial diffusion and friction temperature during Cu-Cu ultrasonic bonding by molecular dynamics simulation.[J]:Tribology International,2025,216:111576
- Zhiqiang Chen,Zhongbin Xie.Investigation of the Thermal Conductance of MEMS Contact Switches.[J]:Micromachines,2025,16(8):872
- Zhao Li,Wenchao Tian,Shaoli Huang,Zhiqiang Chen,Yongkun Wang.Analysis and optimization of Cu/SiO2 hybrid bonding interfacial reliability based on FEA and GABP-NSGA Ⅱ algorithm.[J]:Materials Science in Semiconductor Processing,2025,198:190782
- Zhiqiang Chen,Yunqi Cao,Yuxiao He.A Comprehensive Review of Surface Roughness Effects on Microwave Performance of Transmission Lines.[J]:IEEE Transactions on Microwave Theory and Techniques,2025,73(10):7141-7163
- Hao Cui, Wenchao Tian, Hanyang Xu, Yiming Zhang, Heng Wang, Jiabo Huang, Chunxi Peng, Zhiqiang Chen.The Reliability of the Complex Components under Temperature Cycling, Random Vibration, and Combined Loading for Airborne Applications.[J]:Crystals,2023,13(3):473
- Hao Cui, Wenchao Tian, Yiming Zhang, Zhiqiang Chen,The Study of the Reliability of Complex Components during the Electromigration Process.[J]:Micromachines,2023,14(3):499
- Zhiqiang Chen, Wenchao Tian,Effect of Surface Roughness on the Electrical Performances of CPW Transmission Lines Used in Future Ultra-High Frequency Applications.[J]:Micromachines,2023,14(1):104
- Zhiqiang Chen, Yunqi Cao, Yuxiao He, Wenchao Tian,A thermally activated VO2-based attenuator with SRR structure.[J].美国:Materials & Design,2022,223:111260
- Hao Cui, Wenchao Tian, Xutao Zhao, Zhiqiang Chen,Effect of the reflow process on IMC growth for different devices and complex components.[J]:Smart Materials and Structures,2022,31(11):115028