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个人信息Personal Information
教授 博士生导师 硕士生导师
性别：男
毕业院校：西安电子科技大学
学历：博士研究生毕业
学位：博士研究生毕业
在职信息：在岗
所在单位：微电子学院
入职时间：2015-11-01
学科：集成电路系统设计
办公地点：北校区行政楼129室
电子邮箱：
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研究领域
硅基射频集成电路与系统（低噪声放大器、功率放大器、混频器、锁相环、压控振荡器、无源电路模块等）。
硅基微波/毫米波有源相控阵一体化集成收发系统（低噪声放大器、功率放大器、移相器、衰减器、混频器、可变增益放大器、滤波器等）
- Electrical Modeling And Analysis of Polymer-cavity Through-silicon Vias:2017 IEEE Electrical Design of Advanced Packaging And Systems Symposium (edaps),2017
- Qijun Lu, Jianqin Deng*, Guangbao Shan, and Zhangming Zhu,Wideband Compact Power Amplifier Based on Novel Spatial Power Combining Technique for Millimeter-Wave Applications.[J]:Microwave and Optical Technology Letters,2021,63(1):160-165
- Milimeter-Wave Antenna-in-Package Applications Based on D263T Glass Substrate.[J]:IEEE Access,2020,8:67921-67928
- Qijun Lu, Zhangming Zhu*, Guangbao Shan, Yang Liu, Xiaoxian Liu, Xiangkun Yin,3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications.[J]:IEEE Transactions on Components, Packaging and Manufacturing Technology,2019,9(9):1855-1862
- Through-Silicon Capacitor Interconnection for High Frequency 3-D Microsystem.[J]:IEEE Transactions on Components, Packaging and Manufacturing Technology,2019,9(7):1310-1318
- Qijun Lu, Zhangming Zhu*, Yang Liu, Xiaoxian Liu, Xiangkun Yin,Wideband Electromagnetic Modeling of Coaxial-Annular Through-Silicon Vias.[J]:IEEE Transactions on Electromagnetic Compatibility,2018,60(6):1915−1922
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